The Pattern Language Network

Taming web2.0 in Higher Education

Call for papers: Pragmatic and systematic approaches in applying patterns

Posted by yishaym on September 12, 2008

Browsing through some old notes from EuroPLoP, I found this:

Call for papers: Special Issue of Springer Transactions on Pattern Languages of Programming (TPLOP) “Pragmatic and systematic approaches in applying patterns”

Even though patterns are a software engineering success story and have become mainstream in recent years, the application of the different types of patterns in practice has not yet fully met the expectations of the patterns community yet. Among other reasons, this is due to the inefficient advertisement of patterns to the community, as well as the lack of techniques for using patterns, and for introducing them into organizations. Many practitioners are aware of the GoF patterns and use them regularly in design and coding, but there is little evidence of systematic use of patterns in other areas of software, such as software architecture, analysis, or process. While there are many anecdotes of the benefits of using patterns, the impact of using patterns at any level is still not well understood. We note that there is some increase in teaching patterns in higher education and professional training programmes, but the results are not yet visible in the industry.
This special issue aims at studying the application of patterns in practice both from the practitioners and the researchers’ point of view. The former are pattern-based approaches that have been applied in industrial projects by experienced architects/designers and have shown promising results even if they lack scientific rigor. The latter are scientific approaches by researchers that aim at software engineering methods to support the systematic application of patterns but may still be at the research stage. Approaches that attempt to bridge the gap between these two extremes are particularly welcome.

Journal: http://www.springer.com/computer/lncs?SGWID=0-164-2-470309-0

Full CFP: http://www.springer.com/cda/content/document/cda_downloaddocument/TPLOPSpecialIssue.pdf?SGWID=0-0-45-565298-0

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